The phenomenon of Particle Array, in which flow forces originating from capillary forces and the evaporation of water act,  is used to uniformly align the fine particles of the coating liquid to be coated.

粒子配列プロセス1
1、Before dipping
 粒子配列プロセス2
2、Dipping
粒子配列プロセス3
3、Pull up
粒子配列プロセス4
4、Particle Array
Particle Array拡大図
Enlarged view Particle Array

1. Dipping in the liquid.
2. Dipping a coated material vertically and wait for the liquid surface to become stationary.
3. Pulling up a coated material vertically or diagonally at any speed.
4. Film thickness can be controlled by the speed at which a coated material is pulled up and the concentration of particles in the dipping liquid.


Particle Array is caused by the flow of solvent due to evaporation and the inter-particle forces resulting from surface tension.

Please consult us for larger particle size.

ディップコーターによる横毛管力の説明

Click here for Dip Coater for Particle Array


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